Issue |
E3S Web Conf.
Volume 413, 2023
XVI International Scientific and Practical Conference “State and Prospects for the Development of Agribusiness - INTERAGROMASH 2023”
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Article Number | 05012 | |
Number of page(s) | 9 | |
Section | Environmental & Energy Management | |
DOI | https://doi.org/10.1051/e3sconf/202341305012 | |
Published online | 11 August 2023 |
Modeling of temperature processes in orthotropic boards of radio-electronic devices
Tashkent State Transport University of Republic of Uzbekistan, st. Odilhojaev 1, 100167, Tashkent, Uzbekistan
* Corresponding author: rojkova-elena@mail.ru
The design of electronic equipment that is resistant to external influences is a topical problem. The arrangement of individual circuit parts is modeled in the form of an orthotropic plate. The paper describes the solutions of homogeneous and inhomogeneous thermal conductivity equation for an orthotropic rectangular plate, obtained by the recurrence-operator method. Numerical results are given for two cases of temperature distribution, satisfying zero boundary conditions, during cooling and heating and given initial conditions.
© The Authors, published by EDP Sciences, 2023
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