E3S Web of Conferences

Study on the Spreading Characteristics of the Solder Sn-3.0Ag-0.5Cu on an Inverted V-shaped Substrate

Xiaolin Yang, Bingsheng Xu, Shan Hou, Ren Liu and Xuezhi Zhao

E3S Web Conf., 145 (2020) 02069

Published online: 06 February 2020

DOI: 10.1051/e3sconf/202014502069

Xiaolin Yang

Bingsheng Xu

Shan Hou

Ren Liu

Xuezhi Zhao

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