Study of stress distribution in the various interfaces present in the 3D printing microelectronic systems: Applies to boxes produced by additive manufacturing

^1,2,3 Mechanical Engineering Laboratory, Faculty of Science and Technology, Sidi Mohammed Ben Abdellah University (USMBA), Fès 30000, Morocco
⁴ Industrial Technologies and Services Laboratory, Higher School of Technology, Sidi Mohammed Ben Abdellah University (USMBA), Fès 30000, Morocco

^* Corresponding author: mohamed.houmimi@usmba.ac.ma

Abstract

Additive manufacturing (AM), also known as 3D printing, enables the construction of customized packaging microelectronic systems that are perfectly tailored to component dimensions and specifications. In fused deposition 3D printing technology (FDM), residual stresses are influenced by printing conditions, which reduce material performance and can lead to geometric distortions. During printing, time and temperature affect the thermomechanical properties and crystallization kinetics of the polymer used in FDM. The aim of this work is to evaluate the residual stress in a sample based on the printing conditions (ambient temperature, printing speed and layer thickness). Six points were selected to calculate and compare the residual stress in the sample, with three points in the first layer and three points in the second. Simulation and modeling are utilized to study the effects of printing conditions on the thermomechanical behavior of semicrystalline polymer for an effective assessment.