Issue |
E3S Web Conf.
Volume 111, 2019
CLIMA 2019 Congress
|
|
---|---|---|
Article Number | 04031 | |
Number of page(s) | 8 | |
Section | High Energy Performance and Sustainable Buildings, Simulation models and predictive tools for the buildings HVAC, IEQ and energy | |
DOI | https://doi.org/10.1051/e3sconf/201911104031 | |
Published online | 13 August 2019 |
CLIMA 2019-Modelling study on pipe-encapsulated PCM wall system for building insulation and active heat removal
Department of Building Environment & Energy Engineering, Huazhong University of Science & Technology, 430074, Wuhan, China
* Corresponding author: bexhxu@hust.edu.cn
Phase change material (PCM) can be used in building envelope for heat insulation and energy-saving. However, the energy-saving effect of the PCM wall system is limited in summer since the PCM storing heat in the daytime will become a secondary heat source and release heat into the room again at night. This paper proposed a novel pipe-encapsulated PCM wall system. It integrates phase change technology and nocturnal radiation cooling technology together to realize building insulation and active heat removal. A simulation platform is established for the thermal performance simulation of this wall system. It mainly includes the simplified pipe-encapsulated PCM wall model and nocturnal radiation model. The simplified wall model includes the 5R2C wall model, 4R2C PCM model and 2R1C pipe model. The model parameters are identified and the model is also validated with good accuracy. Based on this platform, the thermal performance of a light weight room with pipe-encapsulated PCM wall system in Wuhan is simulated. About 50%-60% of heat from the outdoor environment can be conserved by the pipe-encapsulated PCM wall, and 50% of that can be removed by the radiant cooler at night. Results show the pipe-encapsulated PCM wall system has good thermal performance for light weight building.
Key words: Pipe-encapsulated PCM wall system / Nocturnal radiation cooling / Active heat removal / Simplified RC model / Thermal performance
© The Authors, published by EDP Sciences, 2019
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