A Fast Drying Machine Based On Semiconductor Heat Pump

Department of energy and power engineering, Wuhan University of Technology, Wuhan, Hubei, 430000, China

^* Corresponding author’s e-mail: wfz285910@whut.edu.cn

Abstract

The new latent heat recovery type semiconductor heat pump ground fast dryer is a kind of integrated semiconductor refrigeration module on the traditional dryer. We simulated the process of the wind being heated by the hot end of the semiconductor refrigeration module under different working conditions through ANSYS software, so as to obtain the best solution for the semiconductor refrigeration module. Using the principles of drying and air condensation, we calculated the influence of the drying rate, drying time, and the condensation effect of the cold end when the air at different hot end inlet wind speeds, ambient temperature and moisture content blows the same amount of moisture on the ground. Through energy-saving analysis, our design saves about 60% energy compared with traditional electric heating style hair dryers. In the case of the same input power, the outlet air temperature of the semiconductor heat pump ground rapid dryer is significantly higher than that of the electric heating hair dryer. Therefore, when the ground is dry with the same amount of moisture, the use of the new semiconductor heat pump ground rapid dryer can significantly shorten drying time, the best drying time shortening rate is as high as 70%.