| Issue |
E3S Web Conf.
Volume 413, 2023
XVI International Scientific and Practical Conference “State and Prospects for the Development of Agribusiness - INTERAGROMASH 2023”
|
|
|---|---|---|
| Article Number | 02001 | |
| Number of page(s) | 6 | |
| Section | Agricultural Engineering and Mechanization | |
| DOI | https://doi.org/10.1051/e3sconf/202341302001 | |
| Published online | 11 August 2023 | |
Technology for cleaning glass substrates in glow discharge plasma for microfluidics applications
Bauman Moscow Technical University, ul. Baumanskaya 2-ya, 5/1, 105005 Moscow, Russia
* Corresponding author: pryanichnikovadm@student.bmstu.ru
The production of microfluidic chips is increasing every year because the technology using the chip allows you to make an express test to obtain the analysis, as well as economically viable. Often microfluidic chips are based on glass in which the microchannels are formed. Accurate production of a microfluidic device requires careful preparation of the glass substrate to improve adhesion for further application of functional layers. The choice of cleaning mode strongly affects the output product, so a clear understanding of what factors affect the quality of cleaning in HF plasma is needed. Mathematical modeling of dependence between plasma power of the glow discharge, time and gas medium first of all gives understanding which cleaning mode is optimal and which parameter affects stronger very relevant for development of this potentially promising technology of quality products.
© The Authors, published by EDP Sciences, 2023
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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