Laser Surface Engineering of Copper Plates: A Laser Texturing Approach for Enhanced Electronics Cooling

¹ Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Al-Sultan Abdullah, Pekan, 26600, Pahang, Malaysia
² Department of Mechanical Engineering, Georgia Southern University, 30460, Statesboro, GA, USA
³ Department of Mechanical Engineering, COMSATS University Islamabad, WAH Campus, 46000, Pakistan

Abstract

The demand for energy is increasing with the advancements in high performance computing systems. The waste heat generation in computing systems can be overcome by efficient cooling systems. Over the last two decades, Laser surface texturing has shown remarkable performance at automotive contacts, mechanical seals and bearings. LST has been used for reducing friction and wear, enhancing lubricant retention, enhancing wettability and heat transfer. In this current study, LST was used to texture copper plates for electronic thermal performance improvement. Three groove patterns were selected and compared with un-textured sample. Thermal characteristics were evaluated using hot plate testing, and wettability performance was measured using laser confocal scanning microscopy, optical microscopy, and contact angle measurements. Results indicate that for electronic cooling application, laser surface modified copper samples can provide better heat dissipation. LST samples showed 2°C reduction in temperature. The reduction can be attributed to improved wettability. The enhanced wettability may cause better thermal paste integration and efficient heat transfer.