| Issue |
E3S Web Conf.
Volume 699, 2026
11th International Conference on Energy and City of the Future (EVF’2024)
|
|
|---|---|---|
| Article Number | 01002 | |
| Number of page(s) | 9 | |
| Section | City and Buildings of the Future | |
| DOI | https://doi.org/10.1051/e3sconf/202669901002 | |
| Published online | 20 March 2026 | |
Numerical modeling of thermal performance of a building envelope incorporating solid-solid phase change material
1 Géosciences & Environnement Cergy, CY Cergy Paris Université, 95033 Cergy cedex, France,
2 ECAM-EPMI, LR2E & Quartz Lab., 13 Boulevard de l’Hautil, 95092 Cergy Pontoise, France,
3 Laboratoire de Physicochimie des Polymères et des Interfaces, CY Cergy Paris Université, 95033 Cergy cedex, France.
* Corresponding author: This email address is being protected from spambots. You need JavaScript enabled to view it.
Abstract
This research focuses on the study of the thermal performance of a building envelope structure incorporating a patented solid-solid phase change material (S-S PCM), designated as PUX-1500-20, a cross-linked polyurethane. This S-S PCM is capable of storing and releasing thermal energy via phase transitions within the human comfort temperature range, facilitating the temporal and spatial transfer of solar energy for optimizing energy efficiency. The primary aim of this work is to study numerically the thermal behavior of the building envelope (hollow brick) filled with the PCMs. The numerical simulations use Matlab software based on the method of the heat equation. In comparison with the thermal behavior of the building envelopes (hollow brick) without PCMs, the results presented herein provide convincing evidence of the important thermal inertia of these structures incorporating the PCMs, revealing their significant potential in contributing to the reduction of energy consumption of building.
Key words: Patented phase change material / solid-solid transition / latent heat storage / cross-linked polyurethane / building integrated / passive thermal storage system / numerical simulation
© The Authors, published by EDP Sciences, 2026
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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