Open Access
| Issue |
E3S Web Conf.
Volume 38, 2018
2018 4th International Conference on Energy Materials and Environment Engineering (ICEMEE 2018)
|
|
|---|---|---|
| Article Number | 04026 | |
| Number of page(s) | 5 | |
| Section | Energy Engineering | |
| DOI | https://doi.org/10.1051/e3sconf/20183804026 | |
| Published online | 04 June 2018 | |
- Zhao Z, Tong Z. 3D-TSVthe continuation of Moore’s law effective way of [J]. Electronic industry special equipment, 2011, 40(03): 10-16. [Google Scholar]
- Shen J, Chen P, Su L, et al. X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm[J]. Microelectronics Reliability, 2016, 67: págs. 129-134. [CrossRef] [Google Scholar]
- Li F, Xiao C, He H, et al. Investigation on the defect induced thermal mechanical stress for TSV[C]// International Conference on Electronic Packaging Technology. IEEE, 2016:713-715. [Google Scholar]
- Pan Y, Li F, He H, et al. Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging[J]. Microelectronics Reliability, 2017, 70:97-102. [CrossRef] [Google Scholar]
- Yuan Y. Thermodynamic analysis of the three dimensional package of silicon through hole [D]. Shanghai Jiao Tong University, 2013. [Google Scholar]
- Li C, Xie X, Shang Y, Huang H, Zou M. Transmission performance analysis of TSV interconnect structure based on electrothermal coupling effect [J]. modern electronic technology, 2017, 40 (08): 4-7. [Google Scholar]
- Huang Q, Shang Y, Zhang M, Li C, Yue K. TSV thermal structure coupling analysis [J]. Electronic components and materials, 2015, 34 (04): 74-78. [Google Scholar]
- Wang H. TSV modeling, heat transfer and loading analysis for three-dimensional laminated package [D]. Xi’an Electronic and Science University, 2012. [Google Scholar]
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