Thermal distribution analysis of inner defects in TSV

Chuan Kai Jiang; Lei Nie; Wen Jia; Yu Ning Zhong

doi:10.1051/e3sconf/20183804026

All issues

Volume 38 (2018)

E3S Web Conf., 38 (2018) 04026

References

Open Access

Issue		E3S Web Conf. Volume 38, 2018 2018 4^th International Conference on Energy Materials and Environment Engineering (ICEMEE 2018)


Article Number		04026
Number of page(s)		5
Section		Energy Engineering
DOI		https://doi.org/10.1051/e3sconf/20183804026
Published online		04 June 2018

Zhao Z, Tong Z. 3D-TSVthe continuation of Moore’s law effective way of [J]. Electronic industry special equipment, 2011, 40(03): 10-16. [Google Scholar]
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Yuan Y. Thermodynamic analysis of the three dimensional package of silicon through hole [D]. Shanghai Jiao Tong University, 2013. [Google Scholar]
Li C, Xie X, Shang Y, Huang H, Zou M. Transmission performance analysis of TSV interconnect structure based on electrothermal coupling effect [J]. modern electronic technology, 2017, 40 (08): 4-7. [Google Scholar]
Huang Q, Shang Y, Zhang M, Li C, Yue K. TSV thermal structure coupling analysis [J]. Electronic components and materials, 2015, 34 (04): 74-78. [Google Scholar]
Wang H. TSV modeling, heat transfer and loading analysis for three-dimensional laminated package [D]. Xi’an Electronic and Science University, 2012. [Google Scholar]

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[1] Zhao Z, Tong Z. 3D-TSVthe continuation of Moore’s law effective way of [J]. Electronic industry special equipment, 2011, 40(03): 10-16. [Google Scholar]

[2] Shen J, Chen P, Su L, et al. X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm[J]. Microelectronics Reliability, 2016, 67: págs. 129-134. [CrossRef] [Google Scholar]

[3] Li F, Xiao C, He H, et al. Investigation on the defect induced thermal mechanical stress for TSV[C]// International Conference on Electronic Packaging Technology. IEEE, 2016:713-715. [Google Scholar]

[4] Pan Y, Li F, He H, et al. Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging[J]. Microelectronics Reliability, 2017, 70:97-102. [CrossRef] [Google Scholar]

[5] Yuan Y. Thermodynamic analysis of the three dimensional package of silicon through hole [D]. Shanghai Jiao Tong University, 2013. [Google Scholar]

[6] Li C, Xie X, Shang Y, Huang H, Zou M. Transmission performance analysis of TSV interconnect structure based on electrothermal coupling effect [J]. modern electronic technology, 2017, 40 (08): 4-7. [Google Scholar]

[7] Huang Q, Shang Y, Zhang M, Li C, Yue K. TSV thermal structure coupling analysis [J]. Electronic components and materials, 2015, 34 (04): 74-78. [Google Scholar]

[8] Wang H. TSV modeling, heat transfer and loading analysis for three-dimensional laminated package [D]. Xi’an Electronic and Science University, 2012. [Google Scholar]