Thermal performance evaluation of a high-density data centre for cooling system under fault conditions

Jinkyun Cho; Beungyong Park; Yongdae Jeong; Sangmoon Lee

doi:10.1051/e3sconf/201911101043

All issues

Volume 111 (2019)

E3S Web Conf., 111 (2019) 01043

References

Open Access

Issue		E3S Web Conf. Volume 111, 2019 CLIMA 2019 Congress


Article Number		01043
Number of page(s)		7
Section		Advanced HVAC&R&S Technology
DOI		https://doi.org/10.1051/e3sconf/201911101043
Published online		13 August 2019

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[1] K. Zhang, Y. Zhang, J. Liu, X. Niu, Applied Thermal Engineering 142 (2018) [Google Scholar]

[2] D. Garday, J. Housley, White paper/Intel Information Technology (2007) [Google Scholar]

[3] J. Cho, T. Lim, B.S. Kim, Energy and Buildings 41(10) (2009) [Google Scholar]

[4] C. Nadjahi, H. Louahlia, S. Lemasson, Sustainable Computing: Informatics & Systems 19 (2018) [Google Scholar]

[5] ASHRAE TC 9.9, Design Considerations for Datacom Equipment Centers (American Society of Heating, Refrigerating and Air-Conditioning Engineers, Inc., Atlanta, GA, 2005) [Google Scholar]

[6] Z. Hasan, ASHRAE Journal 51(2) (2009) [Google Scholar]

[7] B. Hartmann, C. Farkas, Energy and Buildings 127 (2016) [Google Scholar]

[8] Z. He, T. Ding, Y. Liu, Z. Li, Applied Thermal Engineering 141 (2018) [Google Scholar]

[9] Ponemon Institute, Cost of data center outages; data center performance benchmark series (2016) [Google Scholar]

[10] ASHRAE TC 9.9, Thermal Guideline for Data Processing Environments (American Society of Heating, Refrigerating and Air-Conditioning Engineers, Inc., Atlanta, GA, 2015) [Google Scholar]

[11] S. Strutt, C. Kelley, H. Singh, V. Smith, The Green Grid Technical Committee (2012) [Google Scholar]

[12] J. Cho, J. Yang, W. Park, Energy and Buildings 68 (2014) [Google Scholar]

[13] Future Facilities, 6SigmaRoom R8 (2013) [Google Scholar]

[14] L. Silva-Llanca, A. Ortega, K. Fouladi, M. del Valle, V. Sundaralingam, Conference Paper of 14th ITherm (2014) [Google Scholar]