Open Access
E3S Web Conf.
Volume 145, 2020
2019 International Academic Exchange Conference on Science and Technology Innovation (IAECST 2019)
Article Number 02069
Number of page(s) 4
Section International Conference on New Energy Science and Environmental Engineering
Published online 06 February 2020
  1. Shnawah, D. F., Said, S. B. M., Sabri, M. F. M., Badruddin, I. A. & Che, F. X., High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications. Journal of Electronic Materials, 2012. 41(9): 2631-2658. [CrossRef] [Google Scholar]
  2. Sebo, P., Svec, P., Janickovic, D., Illekova, E., Zemankova, M., Plevachuk, Y., Sidorov, V. & Svec, P., The influence of silver content on structure and properties of Sn-Bi-Ag solder and Cu/solder/Cu joints. Material Science and Enginerring A, 2013. 571:184. [Google Scholar]
  3. Hong, S. J., Chang, C. C., Chou, D. H., Sheng, Y. J. & Tsao, H. K., A Drop Pinned by a Designed Patch on a Tilted Superhydrophobic Surface: Mimicking Desert Beetle. The journal of Physical Chemistry C, 2012. 116: 26487-26495. [CrossRef] [Google Scholar]
  4. Chou, T. H., Hong, S. J., Sheng, Y. J. & Tsa, H. K., Drops Sitting on a Tilted Plate: Receding and Advancing Pinning. Langmuir 2012. 28: 5158-5166. [CrossRef] [PubMed] [Google Scholar]
  5. Xu, B. S., Zang, L. K., Yuan, Z. F., Wu, Y. & Zhou, Z., Dissolutive wetting process and interfacial characteristics of molten Sn-17Bi-0.5Cu alloy on copper substrate. Rare metals, 2013. 32(6): 537-543. [Google Scholar]

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