Open Access
| Issue |
E3S Web Conf.
Volume 165, 2020
2020 2nd International Conference on Civil Architecture and Energy Science (CAES 2020)
|
|
|---|---|---|
| Article Number | 06035 | |
| Number of page(s) | 4 | |
| Section | Electrical and Power Engineering | |
| DOI | https://doi.org/10.1051/e3sconf/202016506035 | |
| Published online | 01 May 2020 | |
- D. Liu, F.Y. Zhao, H.X. Yang, et al., Thermoelectric mini cooler coupled with micro thermosiphon for CPU cooling system, Energy, 83 (2015) 29-36. [Google Scholar]
- X. Zhao, J. Sun, C. Wang, et al., Experimental and numerical study of electronic module-cooling heat sinks used in a variable frequency air-conditioner outdoor unit, Int. J. Refrig, 38 (3) (2014) 10-21. [Google Scholar]
- C. Batunlu, A. Albarbar. Real-time system for monitoring the electro-thermal behavior of power electronic devices used in boost converters. Microelectronics Reliability. 62(2016) 82-90. [Google Scholar]
- M Janicki, A Napieralski. Modeling electronic circuit radiation cooling using analytical thermal model. Microelectronics Journal, 31 (9/10) (2000) 781-785. [Google Scholar]
- Ram Viswanath Technology, Abhay Watwe Technology. Thermal Performance Challenges from Silicon to Systems. Intel Corporation Tech Rep, 3(2000) 1-16. [Google Scholar]
- Di Liu, Fu-Yun Zhao, Hong-Xing Yang, Guang-Fa Tang. Thermoelectric mini cooler coupled with micro thermosiphon for CPU cooling system. Energy, 83(2015) 29-36. [Google Scholar]
- SF Zhao, JJ Sun, C Wang, Z Zhang. Experimental and numerical study of electronic module-cooling heat sinks used in a variable frequency air-conditioner outdoor unit. International Journal of Refrigeration, 38 (3) (2014) 10-21. [Google Scholar]
- Akachi H, Miyazaki Y. Stereo-Type Heat Lane Heat Sink. Proceedings of the 10th International Heat Pipe Conferences, Stuttgart, German, 1997. [Google Scholar]
- J Qu, HY Wu, Q Wang. Experimental investigation of silicon-based micro-pulsating heat pipe for cooling electronics. Nanoscale & Microscale Thermophysical Engineering, 16 (1) (2012)37-49. [Google Scholar]
- Kwang-Soo Kim, Myong-Hee Won, Jong-Wook Kim, Byung-Joon Back. Heat pipe cooling technology for desktop PC CPU. Applied Thermal Engineering, 23(9) (2003) 1137-1144. [Google Scholar]
- Yao Shouguang, Ma Zheshu, et al. Improvement of Heat Pipe Technique for High Heat Flux Electronics Cooling. Proceedings of the eighth national heat pipe conference, (2002)317-322. [Google Scholar]
- Ma Yongxi, Zhang Hong. Heat dissipation of electronics and cooling techniques. Chemical Industry and Engineering Progress, 25 (6)(2006) 670-674. [Google Scholar]
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