Universal Adhesives- Different Curing Methods and Applications

Wanying Dong; Xiaojing Gu; Jianghao Han; Liwen You

doi:10.1051/e3sconf/202129001021

All issues

Volume 290 (2021)

E3S Web Conf., 290 (2021) 01021

References

Open Access

Issue		E3S Web Conf. Volume 290, 2021 2021 3^rd International Conference on Geoscience and Environmental Chemistry (ICGEC 2021)


Article Number		01021
Number of page(s)		5
Section		Environmental Chemistry and Chemical Technology Application
DOI		https://doi.org/10.1051/e3sconf/202129001021
Published online		14 July 2021

S. Rimdusit, H. Ishida, Polymer 2000, 41(22), 7941-7949. [Google Scholar]
R.C. Benson, D. Farrar, J.A. Miragliotta, Johns Hopkins APL Technical Digest (Applied Physics Laboratory) 2008, 28(1), 58-71. [Google Scholar]
I. Fotiou, A. Baltopoulos, A. Vavouliotis, V. Kostopoulos, Journal of Applied Polymer Science, 2013, 129(5), 2754-2764. [Google Scholar]
Eun Seon Kim, Jae Heung Lee, Dong Hack Suh, Woo Jin Choi, Macromolecular Research 2021, 29, 129-139 [Google Scholar]
Nasrin Moini, Maryam Khaghanipour, Kourosh Kabiri, Ali Salimi, Mohammad J. Zohuriaan-Mehr, Arash Jahandideh, 5. ACS Sustainable Chemistry & Engineering 2019, 7, 19, 16247–16256. [Google Scholar]
DH Wang, L Jiang. Theory and Application of Ultraviolet Curing Materials [M]. Beijing: Science Press, 2001. [Google Scholar]
YT Xue. Study on Preparation and Properties of UV-Curable Adhesive [D]. Fuzhou University, 2011. [Google Scholar]
V Alessandra, T Giuseppe, B Roberta. Reviews of Adhesion and Adhesives, 2017, 5(2). [Google Scholar]
M Bajpai, V Shukla, A Kumar. J. Progress in Organic Coatings, 2002, 44(4), 271-278. [Google Scholar]
F Dai, F. Chen, T. Wang, S. Feng, C. Hu, X. Wang, Z. Zheng Journal of materials Science, 2016, 51, 4320–4327 [Google Scholar]
Comyn and F Brady and R.A Dust and M Graham and A Haward. International Journal of Adhesion and Adhesives, 1998, 18(1), 51-60. [Google Scholar]
Hai, N., A. D. Skaja, and MD Soucek. J. Progress in Organic Coatings 2000, 40(1), 175-184. [Google Scholar]
Johnston K, Pavuluri S K, Leonard M T, Thermochimica Acta, 2015, 616(20), 100-109. [Google Scholar]
S.K. Pavuluri, M.P.Y. Desmulliez, G. Goussetis, et al. Post cure behaviour of encapsulants for QFNpackages processed by an open-ended single mode resonant microwaveapplicator, 2011 IEEE ¹³th Electronics Packaging Technology Conference(EPTC), 2011, 573–578. [Google Scholar]
R.C. Benson, D. Farrar, J.A. Miragliotta. Polymer adhesives and encapulants formicroelectronic application, Johns Hopkins Apl Tech. Dig. 2008, 28, 58-71. [Google Scholar]

Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.

Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.

Initial download of the metrics may take a while.

[1] S. Rimdusit, H. Ishida, Polymer 2000, 41(22), 7941-7949. [Google Scholar]

[2] R.C. Benson, D. Farrar, J.A. Miragliotta, Johns Hopkins APL Technical Digest (Applied Physics Laboratory) 2008, 28(1), 58-71. [Google Scholar]

[3] I. Fotiou, A. Baltopoulos, A. Vavouliotis, V. Kostopoulos, Journal of Applied Polymer Science, 2013, 129(5), 2754-2764. [Google Scholar]

[4] Eun Seon Kim, Jae Heung Lee, Dong Hack Suh, Woo Jin Choi, Macromolecular Research 2021, 29, 129-139 [Google Scholar]

[5] Nasrin Moini, Maryam Khaghanipour, Kourosh Kabiri, Ali Salimi, Mohammad J. Zohuriaan-Mehr, Arash Jahandideh, 5. ACS Sustainable Chemistry & Engineering 2019, 7, 19, 16247–16256. [Google Scholar]

[6] DH Wang, L Jiang. Theory and Application of Ultraviolet Curing Materials [M]. Beijing: Science Press, 2001. [Google Scholar]

[7] YT Xue. Study on Preparation and Properties of UV-Curable Adhesive [D]. Fuzhou University, 2011. [Google Scholar]

[8] V Alessandra, T Giuseppe, B Roberta. Reviews of Adhesion and Adhesives, 2017, 5(2). [Google Scholar]

[9] M Bajpai, V Shukla, A Kumar. J. Progress in Organic Coatings, 2002, 44(4), 271-278. [Google Scholar]

[10] F Dai, F. Chen, T. Wang, S. Feng, C. Hu, X. Wang, Z. Zheng Journal of materials Science, 2016, 51, 4320–4327 [Google Scholar]

[11] Comyn and F Brady and R.A Dust and M Graham and A Haward. International Journal of Adhesion and Adhesives, 1998, 18(1), 51-60. [Google Scholar]

[12] Hai, N., A. D. Skaja, and MD Soucek. J. Progress in Organic Coatings 2000, 40(1), 175-184. [Google Scholar]

[13] Johnston K, Pavuluri S K, Leonard M T, Thermochimica Acta, 2015, 616(20), 100-109. [Google Scholar]

[14] S.K. Pavuluri, M.P.Y. Desmulliez, G. Goussetis, et al. Post cure behaviour of encapsulants for QFNpackages processed by an open-ended single mode resonant microwaveapplicator, 2011 IEEE ¹³th Electronics Packaging Technology Conference(EPTC), 2011, 573–578. [Google Scholar]

[15] R.C. Benson, D. Farrar, J.A. Miragliotta. Polymer adhesives and encapulants formicroelectronic application, Johns Hopkins Apl Tech. Dig. 2008, 28, 58-71. [Google Scholar]