Open Access
Issue |
E3S Web Conf.
Volume 297, 2021
The 4th International Conference of Computer Science and Renewable Energies (ICCSRE'2021)
|
|
---|---|---|
Article Number | 01048 | |
Number of page(s) | 9 | |
DOI | https://doi.org/10.1051/e3sconf/202129701048 | |
Published online | 22 September 2021 |
- A. Baudot, J. Moysan, C. Payan, N. Ylla, J. Galy, B. Verneret and A. Baillard, Improving adhesion strength analysis by the combination of ultrasonic and mechanical tests on single-lap joints, J. Adhesion, 90, 555–568 (2014) [Google Scholar]
- W. Wang and S. I. Rokhlin, Evaluation of interfacial properties in adhesive joints of aluminium alloys using angle-beam ultrasonic spectroscopy, J. Adhes. Sci. Technol. 5, 647–666 (1991) [Google Scholar]
- A. I. Lavrentyev and S. I. Rokhlin, Determination of elastic moduli, density, attenuation, and thickness of a layer using ultrasonic spectroscopy at two angles, J. Acoust.Sci. Am. 102, 3467–3477 (1997) [Google Scholar]
- R. L. Vijaya Kumar, M. R. Bhat, and C. R. L. Murthy, Some studies on evaluation of degradation in composite adhesive joints using ultrasonic techniques, Ultrasonics 53, 1150–1162 (2013) [CrossRef] [PubMed] [Google Scholar]
- R. Seifried, J. L. Jacobs and J. Qu, Propagation of guided waves in adhesive bonded components, NDT & E International, 35, 317–328 (2002) [Google Scholar]
- A. Balvantin, A. Baltazar, and J. I. Andra-Sanchez, A study of guided wave propagation on a plate between two solid bodies with imperfect boundary conditions, Int. J. Mech. Sci. 63, 66–73 (2012). [Google Scholar]
- M. Castaings, SH ultrasonic guided waves for the evaluation of interfacial adhesion, Ultrasonics 54, 1760–1775 (2014) [CrossRef] [PubMed] [Google Scholar]
- S. Mezil, F. Bruno, S. Raetz, J. Laurent, D. Royer, and C. Prada, Investigation of interfacial stiffnesses of a tri-layer by using Zero-Group Velocity Lamb modes, J. Acoust. Soc. Ame. 138, 3202–3209 (2015) [Google Scholar]
- P. T. Birgani, S. Sodagar and M. Shishesaz, Generation of low-attenuation Lamb wave modes in three-layer adhesive joints, Int. J. Acoust and Vibra. 22, 51–57 (2017) [Google Scholar]
- C. Gauthier, M. E. El-Kettani, J. Galy, M. Predoi, D. Leduc and J. Izbicki, Lamb waves characterization of adhesion levels in aluminium/epoxy bi-layers with different cohesive and adhesive properties, Int. J. Adhesion and adhesives. 74, 15–20 (2017) [Google Scholar]
- N. Mori, N. Matsuda, and T. Kusaka, Effect of interfacial adhesion on the ultrasonic interaction with adhesive joints : A theoretical study using spring-type interfaces, J. Acoust. Soc. Ame. 145, 3541–3550 (2019) [Google Scholar]
- N. Mori and S. Biwa, Transmission of Lamb waves and resonance at an adhesive butt joint of plates, Ultrasonics. 72, 80–88 (2016) [CrossRef] [PubMed] [Google Scholar]
- N. Mori and S. Biwa, Transmission characteristics of the SO and A0 Lamb waves at contacting edges of plates, Ultrasonics. 81, 93–99 (2017) [CrossRef] [PubMed] [Google Scholar]
- W. Wu, X. Wang, Z. Huang and N. Wu, Measurements of the weak bonding interfacial stiffness by using air-coupled ultrasound, AIP. Advances. 7, 1253161–12531614 (2017) [Google Scholar]
- L. M. Brekhovskikh, Waves in Layered Media, New York: Academic Press, 1980 [Google Scholar]
- A. Pilarski and J. L. Rose, Ultrasonic oblique incidence for improved sensitivity in interface weakness determination, NDT Int. 21, 241–246 (1988) [Google Scholar]
- A. Pilarski, J. L. Rose, and K. Balasubramaniam, The angular and frequency characteristics of reflectivity from a solid layer embedded between two solids with imperfect boundary conditions, J. Acoust. Soc. Am. 87, 532–542 (1990) [CrossRef] [Google Scholar]
Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.
Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.
Initial download of the metrics may take a while.