Open Access
Issue |
E3S Web of Conf.
Volume 458, 2023
International Scientific Conference Energy Management of Municipal Facilities and Environmental Technologies (EMMFT-2023)
|
|
---|---|---|
Article Number | 10026 | |
Number of page(s) | 12 | |
Section | Energy Engineering and Mechanical Engineering | |
DOI | https://doi.org/10.1051/e3sconf/202345810026 | |
Published online | 07 December 2023 |
- Watson J., Castro G., Journal of Materials Science: Materials in Electronics. 2015. № 26. Pp. 9226–9235.DOI: https://doi.org/10.1007/s10854-015-3459-4 [Google Scholar]
- Watson J., Castro G., Analog Dialogue. 2012. № 46 (2), Pp. 3–9 (2012). URL: https://api.semanticscholar.org/CorpusID:17194747 [Google Scholar]
- Arkin M., Watson J., High Temperature Conference Papers. Engineering. Vol. 2013. DOI: 10.4071/HITEN-TA17 [Google Scholar]
- Watson J., Pachchigar M. Low Power Data Acquisition Solution for High Temperature Electronics Applications. // Computer Science. 2015. [Google Scholar]
- Xiao Y., Zhang Z., Andersen M., Engineering. 2022. IEEE Transactions on Power Electronics. V. 37. Pp. 14831–14849. DOI: 10.1109/TPEL.2022.3148192 [CrossRef] [Google Scholar]
- Reynolds C., Materials Science. 2017. IEEE Power Electronics Magazine. V.4. Pp. 43–47. DOI:10.4071/2016-HITEC-299. [CrossRef] [Google Scholar]
- Tian Ye. Silicon Carbide Sigma-Delta Modulator for High Temperature Applications. // Engineering. 2014. [Google Scholar]
- Bultitude J., Jones L., Materials Science. 2014. Journal of Microelectronics and Electronic Packaging. V. 14. Pp. 000112–000120. DOI: 10.4071/IMAPS.432 [Google Scholar]
- Cojbasic R., Computer Science. 2014. V. 14. DOI: 10.5075/ epfl-thesis-6369. URL: https://api.semanticscholar.org [Google Scholar]
- Benediktov A., Ignatov P., Engineering. Russian Microelectronics. 2018. V. 47. Pp. 317–322. DOI: 10.1134/S1063739718050037. [CrossRef] [Google Scholar]
- Kumar R., Ke F., Young L. A High Temperature Vapor Phase Conformal Coating for Improving Reliability of Harsh Environment Electronics.// Engineering. 39th International Spring Seminar on Electronics Technology (ISSE). 2016. Pp. 128 – 133. DOI: 10.1109/ISSE.2016.7563174 [Google Scholar]
- Texas Instruments. URL: http://www.ti.com/product/ (date of application: 15.09.2023). [Google Scholar]
- Drivers/High-Temperature ICs.URL: http://www.atmel.com/products/automotive/drivers(датаобр: 15.09.2023). [Google Scholar]
- CISSOID. URL: http://www.cissoid.com/ (date of application:15.09.2023). [Google Scholar]
- Huiyun M., Liangliang D., Chenggang Y. Yukun F., etc. 2019. Petroleum, №6 (V. 3). DOI: 10.1016/j.petlm.2019.11.003 [Google Scholar]
- Kulchitskiy V.V. Intellectualization of well systems – innovative direction in the development of oil–and–gas fields. // 2021. International Sc.–Pract. Conf. “Intellectual deposit: world practice and modern technologies”. Moscow: Gubkin Research Institute of the Russian Academy of Sciences. Pp. 27–30. [Google Scholar]
- Sarkodie K., Nkrumah K. Intelligent Well Technology–Dealing with Gas Coning Problems in Production of Intelligent Wells. // Engineering. 2014. URL: https://api.semanticscholar.org(date of application: 15.09.2023). [Google Scholar]
- Cheremisin A.N., Ryazantsev A.E., Toropetsky K.V., Bulletin of the Central Research Committee. Rosnedra. 2022. No. 1. Pp. 2–6. [Google Scholar]
- Skupov A.N., etc. Technological Materials for High–Temperature Microcircuits. // Vector of High Technologies. 2017. No. 6 (35). Pp. 28 – 33. [Google Scholar]
- Shepherd P., Smith S.C., Holmes J., etc. Robust, Wide–Temperature Data Transmission System for Space Environments. // 2013 IEEE Aerospace Conf. Pp. 1–13.DOI: 10.1109/AERO.2013.6497376. [Google Scholar]
- Willet M., Ward M., Behbahani A. Using High Temperature Electronics for Distributed Controls of Turbine Engines.//46thAIAA/ASME/SAE/ASEEJoinPropulsionConf.&Exhibit,2020.Pp.1–13. DOI: 20.2514/6.2010-6834 [Google Scholar]
- Bobkov S.G., Eremin A.V., Software Products and Systems. 2015 4. 49–55. [Google Scholar]
- Bobkov S.G., Bulletin of the Russian Academy of Sciences 2015. Vol. 84. No. 11. Pp. 1010–1016. [Google Scholar]
- Cherckesova L. V. et al. Electronics. – 2022. – Т. 11. – №. 23. – С. 3954. [CrossRef] [Google Scholar]
- Korochentsev, D.A., Cherckesova, L.V., Revyakina, E.A., Goncharov, R.A. Journal of Physics: Conference Seriesthis link is disabled, 2021, 2131(2), DOI 10.1088/1742-6596/2131/2/022091 [Google Scholar]
- Sharif A. Harsh Environment Electronics: Interconnect Materials and Performance Assessment. // 2019. E-Book. 400 p. ISBN: 978-3-527-81397-1 DOI: 10.1002/9783527813964 [Google Scholar]
- Khanna V.K. ExtremeTemperature and Harsh-Environment Electronics: Physics, Technology and Applications. // IOP Publishing Ltd. 2021.791 p. DOI:10.1088/978-0-7503-1155-7 [Google Scholar]
Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.
Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.
Initial download of the metrics may take a while.