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Cited article:

Reliability Simulation and Life Prediction of TSV Under a Thermoelectric Coupling Field in a 3D Integrated Circuit

Hao Ni, Liang He, Hua Chen and Xiaofei Jia
Journal of Electronic Materials 50 (6) 3592 (2021)
https://doi.org/10.1007/s11664-021-08866-z