Issue |
E3S Web Conf.
Volume 267, 2021
7th International Conference on Energy Science and Chemical Engineering (ICESCE 2021)
|
|
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Article Number | 02066 | |
Number of page(s) | 5 | |
Section | Environmental Chemistry Research and Chemical Preparation Process | |
DOI | https://doi.org/10.1051/e3sconf/202126702066 | |
Published online | 04 June 2021 |
Effect of hexamethylenetetramine on surface smoothness of electroplated copper coating
1 Chongqing Engineering Research Center of New Energy Storage Devices and Applications, Chongqing University of Arts and Sciences Chongqing, 402160, China
2 Postdoctoral Research Station, China Silian Instrument Group Co., Ltd, 400707, China
a Corresponding author: xiangjing@cqwu.edu.cn
In this paper, hexamethyltetramine is introduced into the electroplating bath to improve the surface morphology of electrodeposited copper. The cyclic voltammetry (CV) and dynamic polarization curves are used to study the effect of Cu(Ⅰ) and hexamethyltetramine on the electrochemical behaviors of electroplating solution. After implementing the electrodeposited copper experiment, scanning electron microscope (SEM) and X-ray diffraction (XRD) are used to explore the influence of Cu(Ⅰ) and hexamethyltetramine on the Surface morphology and crystal plane orientation of the electrodeposited copper. The results show that 5ppm hexamethyltetramine and 7.5ppm hexamethyltetramine can solve the problem of the loose and uneven surface of the electroplated copper layer caused by Cu(Ⅰ).
© The Authors, published by EDP Sciences, 2021
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