Open Access
E3S Web Conf.
Volume 197, 2020
75th National ATI Congress – #7 Clean Energy for all (ATI 2020)
Article Number 10008
Number of page(s) 10
Section Heat Transfer and Fluid Dynamics
Published online 22 October 2020
  1. L.-T. Yeh and R.C. Chu, Thermal Management of Microelectronic Equipment:Heat Transfer Theory, Analysis Methods and Design Practices (ASME Press, New York, 2002). [Google Scholar]
  2. S.M. Sohel Murshed and C.A. Nieto de Castro, Renewable and Sustainable Energy Reviews 78, 821 (2017). [CrossRef] [Google Scholar]
  3. W. Nakayama, Applied Mechanics Reviews 39, 1847 (1986). [CrossRef] [Google Scholar]
  4. A. Bar-Cohen, IEEE Transactions on Components, Hybrids, and Manufacturing Technology 10, 159 (1987). [CrossRef] [Google Scholar]
  5. Y.A. Cengel, Heat Transfer A Pratical Approach, 2nd Edition (2002). [Google Scholar]
  6. H.Y. Zhang, D. Pinjala, and Poi-Siong Teo, in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (IEEE, Singapore, 2003), pp. 620–625. [Google Scholar]
  7. A. Ristow, M. Begovic, A. Pregelj, and A. Rohatgi, IEEE Trans. Ind. Electron. 55, 2581 (2008). [CrossRef] [Google Scholar]
  8. A. Capozzoli and G. Primiceri, Energy Procedia 83, 484 (2015). [CrossRef] [Google Scholar]
  9. A. Habibi Khalaj and S.K. Halgamuge, Applied Energy 205, 1165 (2017). [CrossRef] [Google Scholar]
  10. A. Heydari, in Heat Transfer: Volume 4 (ASMEDC, San Francisco, California, USA, 2005), pp. 877–884. [Google Scholar]
  11. G. Lefevre, N. Degrenne, and S. Mollov, in 2014 16th European Conference on Power Electronics and Applications (IEEE, Lappeenranta, Finland, 2014), pp. 1–10. [Google Scholar]
  12. Product Flyer for ULTRA-TL-OUTD ABB Solar Inverters, (2017). [Google Scholar]
  13. Garron K. Morris, M.G. Phillips, L. Wei, and R.A. Lukaszewski, in 2016 Annual Reliability and Maintainability Symposium (RAMS) (IEEE, Tucson, AZ, USA, 2016), pp. 1–7. [Google Scholar]
  14. D. Guan, M. Marz, and J. Liang, IEEE Trans. Compon., Packag. Manufact. Technol. 2, 278 (2012). [CrossRef] [Google Scholar]
  15. K.-S. Yang, C.-H. Chung, C.-W. Tu, C.-C. Wong, T.-Y. Yang, and M.-T. Lee, Applied Thermal Engineering 70, 361 (2014). [CrossRef] [Google Scholar]
  16. B. Vermeersch and G. De Mey, Microelectronics Reliability 48, 734 (2008). [CrossRef] [Google Scholar]
  17. S. Song and K.P. Moran, ASME/JSME Thermal Engineering Conference 4, 8 (1995). [Google Scholar]
  18. S. Song, S. Lee, and V. Au, Closed-Form Equation for Thermal Constriction/Spreading Resistance with Variable Resistance Boundary Condition (International Electronics Packaging Society, Wheaton, Ill, 1994), pp. 111–121. [Google Scholar]
  19. D. Bohne, S. Fischer, and E. Obermeier, Berichte Der Bunsengesellschaft Für Physikalische Chemie 88, 739 (1984). [CrossRef] [Google Scholar]

Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.

Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.

Initial download of the metrics may take a while.