Open Access
E3S Web Conf.
Volume 389, 2023
Ural Environmental Science Forum “Sustainable Development of Industrial Region” (UESF-2023)
Article Number 01036
Number of page(s) 7
Section Materials Science Innovations, Green Chemistry and Emission Reduction
Published online 31 May 2023
  1. Abdurakhmonov S.M., Sayitov Sh.S. Scientific-technical journal-STJ FerPI. 23(s.3). pp.197-201. (2021). [Google Scholar]
  2. Saitov, Sh. S., S. M. Abdurakhmonov, E. A. Oshchepkova, D. Kh. Rakhmonov, and M. Sh. Khuriboeva. Actual science 9. pp.22-27. (2019). [Google Scholar]
  3. Solutions solutions for the automotive glass industry. [Google Scholar]
  4. International patent. JP 2012-91216 A. (2010). [Google Scholar]
  5. Abdurakhmonov S.M., Sayitov Sh.S. et al Scientific-technical journal-STJ FerPI. 25(6), pp.256-259. (2021). [Google Scholar]
  6. Shavkat, Sayitov. Texas Journal of Engineering and Technology. 14. pp.59-63. (2022). [Google Scholar]
  7. Abdurakhmonov S.M., Sayitov Sh.S. Scientific-technical journal. STJ FerPI, 2019, volume 23, special number 3, pp. 105-108. [Google Scholar]
  8. Otakulov O.Kh., Abdurakhmonov S.M. Proceedings of the Actual problems of the introduction of innovative techniques and technologies at enterprises for the production of building materials, chemical industry and related industries. May 24-25 2019. 1. (2019). [Google Scholar]
  9. Mackay John. Forming solder balls on substrates. 2006-03-07. US US7007833B2. (Patent). (2006). [Google Scholar]
  10. Hideo Nakagoshi Murata. Electronic component module and method for manufacturing the same. 2015-06-11. US CN JP KR TW TWI488557B. (Patent) [Google Scholar]
  11. Kazuaki Karasawa. The substrate with terminal pads having respective single solder bumps formed. 2005-03-24. US20050062157A1. (Patent). (2005). [Google Scholar]
  12. Kiyokazu Yasuda., Jong-Min Kim. Method for interconnecting terminals and method for mounting semiconductor devices. 2008-08-06. WO2004070827A1 (Patent). (2008). [Google Scholar]
  13. Takashi Shoji., Ayako Nishioka., Tadatoshi Kurozumi., Yoshinori Shibuya., Hitoshi Amita. Solder metal, soldering flux and solder paste. 2010-06-16. US20060071051A1. (Patent). (2010). [Google Scholar]
  14. Kimio Yamakawa., Katsutoshi Mine. Soldering flux, cream solder, soldering method, food container, and electronic component. 2007-03-29. WO2007034758A1. (Patent). (2007). [Google Scholar]
  15. Xian Maeda., Tadahiko Jing. Soldering flux and soldering method. 2011-02-23. JP4633630B2. (Patent). (2011). [Google Scholar]
  16. Fujiuchi S. Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact. 11. p.243. (2003). [Google Scholar]

Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.

Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.

Initial download of the metrics may take a while.