Molecular dynamics study of effect of wettability on rapid boiling over copper nanoparticle in water pool

Beijing Raymer Technology Co., Ltd. Beijing, 1000142, China

18630146541@163.com

Abstract

Many special phenomena occur during rapid boiling of a liquid when it is largely superheated near the thermodynamic critical temperature which is much higher than the saturation temperature. However, although there are many experimental work reported the observation of rapid ejection near the surface region of the materials, they are limited in either length or time scales due to the limitation of classical macroscopic theory. In this work, molecular dynamics simulation of heat transfer from nanoparticle to a surrounding liquid pool is carried out to study the effect of solid-liquid interfacial wettability on the boiling phenomena of water around the nanoparticle. The interactions among copper atoms are described by the embedded atom method (EAM) potentials, and the TIP4P water model is used to describe water atoms. The results show that the interfacial thermal conductance is influenced by the interfacial wettability. Increasing the wettability between the particle and the fluid reduces the interfacial resistance. The nucleation of bubbles and formation of vapor occur more quickly for increased solid-liquid interfacial wettability. The results might change due to the uncertainties of the potential functions, therefore further investigation is worthwhile to study rapid boiling of water on nanoparticles using different water models.