Issue |
E3S Web Conf.
Volume 252, 2021
2021 International Conference on Power Grid System and Green Energy (PGSGE 2021)
|
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Article Number | 02067 | |
Number of page(s) | 5 | |
Section | Research and Development of Electrical Equipment and Energy Nuclear Power Devices | |
DOI | https://doi.org/10.1051/e3sconf/202125202067 | |
Published online | 23 April 2021 |
A non-metallic additive for diamond-wire-sawn multi-crystalline silicon texturing
1 Key Laboratory of Solar Thermal Energy and Photovoltaic System of Chinese Academy of Sciences, Institute of Electrical Engineering, The Chinese Academy of Sciences, Beijing, China 100190
2 University of Chinese Academy of Sciences, Beijing, China 100049
a email: wanghe@mail.iee.ac.cn
* corresponding author:
b email: zhouchl@mail.iee.ac.cn
Diamond-wire-sawn (DWS) technology has been widely used in the photovoltaic industry. When using the HF/HNO3/H2O acid etching solution for texturing of DWS multi-crystalline silicon(mc-Si), the aid of additive is required to improve the reactivity of the mc-Si surface in the acid texturing solution. It also needs to enhance the nucleation and uniform growth of the texturing surface. This paper proposes a non-metallic additive for DWS mc-Si texturing. Sodium polyacrylate is added to the HF/HNO3/H2O acid etching solution to reduce the reflectance of DWS mc-Si and improve surface morphology. Compared to the textured wafers without additive, the surface of the wafers using this method is uniformly distributed with pits whose size is 0.5 μm×1 μm. And the weighted average reflectance of the textured wafers can be reduced from 33.32% to 23.9% in the wavelength range of 350–1100 nm, with the lowest reflectance of 19.8% reached at 950 nm. It shows a promising application prospect.
© The Authors, published by EDP Sciences, 2021
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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