Issue |
E3S Web Conf.
Volume 184, 2020
2nd International Conference on Design and Manufacturing Aspects for Sustainable Energy (ICMED 2020)
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Article Number | 01012 | |
Number of page(s) | 8 | |
DOI | https://doi.org/10.1051/e3sconf/202018401012 | |
Published online | 19 August 2020 |
Comparison of GAN, SIC, SI Technology for High Frequency and High Efficiency Inverters
Department of Electrical Engineering, GRIET, Hyderabad, Telangana, India.
Power semiconductor devices plays a major role in efficient power conversion. As we have Silicon (Si), Silicon Carbide (SiC) and Gallium Nitride (GaN) based power devices, GaN technologies are ideal for working in high frequency power electronic systems (in MHz). Because the GaN has superior electron mobility and bandgap than the SiC and Si it has superior characteristics like low conduction losses, high switching rate so that there is better power efficiency than SiC, Si based inverter. Here we are using the Gan based High-Electron-Mobility Transistor (HEMT) and SiC and Si based mosfet in the inverter. The proposed inverter of different topologies is designed to transfer the power at >1MHz range. Comparison of the three different switches is done by the output power and the efficiency of the inverter. This paper presents the SPICE simulation results of the class d and class e inverter of output power 1KW.
© The Authors, published by EDP Sciences, 2020
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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